Solar energy technology is also used to create solar cells with the help of Tungsten Carbide Inserts

Engineers start the process by designing the circuits and also by defining the essential functions. Afterwards the cylinder shaped pure silicon is carefully withdrawn. Then the ingot (cylinder shaped pure silicon) is thinly sliced, using a diamond saw and silicon slices are sorted according to the thickness of each silicon wafer. P-Type silicon wafers are very common in terms of sales volume and production. These types of wafers are formed with only one type of dopant called boron. The price of wafer is determined based on the quality and thickness. Other types like Gallium Arsenide and SOI are silicon insulator. And the amount of dopant determines its final resistivity. The technology is changing rapidly and with the new technology comes denser packing of the features.

The electrical properties of silicon can be manipulated by adding the other elements called “dopants” which determine the type of silicon either negative or positive, and change the resistivity of silicon to make it more conductive.

Wafers then exposed to UVB light. The huge abundance of P-Type silicon wafers tends to reduce the costs than the N-Type wafer. Top companies of information technology and electronics use SOI wafers to produce the microprocessors. Several important steps are to be followed before preceding the manufacturing. Specifications of the customer will also be ensured before the final delivery of the product. They are used in electronics, which requires careful and accurate manufacturing to ensure high levels of efficiency. If the silicon surface of any wafer found damaged or cracked then it is removed using the process called as lapping. In the slicing process the defects are being checked by the manufacturers. Special software are used to determine the specifications like signals, outputs, voltages and inputs. Due to its capacity to conduct both heat and electricity in a way that is very controlled it can become the efficient material in the electronic sphere by just undergoing processes such as fabrication and photolithography.

Uneven surfaces need to be polished to create a smooth and flat surface. Amount of boron in the silicon wafer determines its resistivity; the less boron the more will be the resistivity while the more boron the lower resistivity.Next step is to check the flatness and thickness. Solar energy technology is also used to create solar cells with the help of Tungsten Carbide Inserts GaAs and silicon. The type of dopant determines the final wafer, whether the wafer is an N-Type or a P-Type

Megosztás a facebookon